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Shenzhen Huafu Fast Multilayer Circuit Co. LTD
Shenzhen Huafu Fast Multilayer Circuit Co. LTD
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1.6MM 3MIL 2OZ Printed Board Assembly Rigid Flex PCB Fabrication 8 Layers

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Shenzhen Huafu Fast Multilayer Circuit Co. LTD
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1.6MM 3MIL 2OZ Printed Board Assembly Rigid Flex PCB Fabrication 8 Layers

  • 1.6MM 3MIL 2OZ Printed Board Assembly Rigid Flex PCB Fabrication 8 Layers
  • 1.6MM 3MIL 2OZ Printed Board Assembly Rigid Flex PCB Fabrication 8 Layers
Contact Now

1.6MM 3MIL 2OZ Printed Board Assembly Rigid Flex PCB Fabrication 8 Layers

Capability 　 High precision prototype PCB bulk production Max Layers 1-28 layers 1-14 layers MIN Line width(mil) 3mil 4mil MIN Line space(mil) 3mil 4mil Min via (mechanical drilling) Board thickness...

Product Tags:

2OZ printed board assembly

      

3MIL printed board assembly

      

1.6MM rigid flex pcb fabrication

      
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