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Shenzhen Huafu Fast Multilayer Circuit Co. LTD
Shenzhen Huafu Fast Multilayer Circuit Co. LTD
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HDI 1.0mm FR4 Fast Turn PCB Assembly Production OSP Impedance

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HDI 1.0mm FR4 Fast Turn PCB Assembly Production OSP Impedance

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Brand Name : HF

Place of Origin : China

MOQ : 5PCS

Price : Negotiable

Delivery Time : 5~8 days

Packaging Details : box

Certification : ISO CE

Payment Terms : L/C, T/T,PAYPAL

Model Number : HDI PCB

base material : FR4 ,Rogers , Aluminum ,Hight TG

layer count : 1-32

board thickness : 0.4-3.2mm

copper thickness : 1-4oz

solder color : green black blue red white yellow

silkscreen color : white

NIN hole size : 0.15mm

surface finishing : HASL(lead Free) / Immersion Gold /osp / Immersion tin/Immersion silver

Material : FR4 ,Rogers , Aluminum ,High TG,CEM1, CEM3, Halogen Free

Layer Coun : 1-40

Solder Mask color : green, yellow,white, blue,black,red

Service : OEM/ODM/PCB/Components Sourcing/Assembly/Programming/Testing...One-stop Turnkey Service.

Test : 100% AOI, X-ray, Flying probe test.

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Application
Products are applied to a wide range of High-tech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries

Capability

　High precision prototypePCB bulk production
Max Layers1-28 layers1-14 layers
MIN Line width(mil)3mil4mil
MIN Line space(mil)3mil4mil
Min via (mechanical drilling)Board thickness≤1.2mm0.15mm0.2mm
Board thickness≤2.5mm0.2mm0.3mm
Board thickness＞2.5mmAspect Ration≤13:1Aspect Ration≤13:1
Aspect RationAspect Ration≤13:1Aspect Ration≤13:1
Board thicknessMAX8mm7mm
MIN2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm
MAX Board size610*1200mm610*1200mm
Max copper thickness0.5-6oz0.5-6oz
Immersion Gold/
Gold Plated Thickness		Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”		　
Hole copper thick25um 1mil25um 1mil
ToleranceBoard thicknessBoard thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%		Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Outline Tolerance≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm		≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm
Impedance±10%±10%
MIN Solder mask bridge　0.08mm　0.10mm
Plugging Vias capability　0.25mm--0.60mm　0.70mm--1.00mm


Advantages
1. PCB factory directly
2. Comprehensive quality control system
3. Competitive price
4. Quick turn delivery time from 48hours.
5. Certificates (ISO/UL E354810/RoHS)
6. 9 years experience in exporting service
7. No MOQ/MOV.
8. High quality. Strict through the AOI(Automated Optical Inspection), QA/QC, flying porbe ,Etesting, etc


HDI 1.0mm FR4 Fast Turn PCB Assembly Production OSP Impedance


Product Tags:

hdi fast turn pcb assembly

      

FR4 fast turn pcb production

      

1.0mm fast turn pcb assembly

      
Quality HDI 1.0mm FR4 Fast Turn PCB Assembly Production OSP Impedance for sale

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